| 摘要 |
PROBLEM TO BE SOLVED: To use for a pressure sensitive adhesive tape during the production of a semiconductor device by forming a mold releasing layer containing a curing silicone resin containing fluorine as a main component on the surface of a polyester film which contains silicon dioxide particles of a specified particle size and a specified amount of a germanium element but does not contain other metal components. SOLUTION: A mold releasing layer containing a curing silicone resin containing fluorine as a main component is formed at least on one side of a polyester film which contains 10-200ppm of a germanium element and 0.01-2wt.% of silicon dioxide of 0.01-5μm average particle size but does not contain other metal components substantially. For this purpose, an esterification reaction is adopted for producing polyester, and a germanium compound which scarcely disturbs the normal functions of a semiconductor device is used as a catalyst. As the germanium compound, for example, the oxide, inorganic acid salt, organic acid salt, halide, and sulfide of germanium are named, but germanium dioxide is preferable in particular.
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