| 摘要 |
<p>A tiled sputtering target (10) prepared from ceramic tiles (12), for use in a vapor deposition process, and affording large target areas (10) and small spaces (18) between tiles (12) for the uniform introduction of the sputtering gases. In the preferred embodiment, the tiled sputtering target (10) is comprised of many small ceramic tiles (12), which are attached to the backing plate (14) by a soft solder such as indium. The tiles (12) are arranged close to one another, but spaces (18) are formed therebetween. The backing plate (14) has holes (15) formed therein, and the holes (15) and spaces (18) enable uniform introduction of the sputtering gas into the plasma developed in the vapor deposition process, and enhances control of the plasma uniformity, with resulting films being uniform. Each of the small ceramic tiles (12) can be fabricated very densely and uniform as pressed pellets.</p> |
