PRESS FOR ENCAPSULATING ELECTRONIC COMPONENTS AND METHODS FOR USE OF THE PRESS

摘要

The invention relates to a device for encapsulating electronic components, mounted on so-called lead frames, in a mould assembled from two mould halves (2, 3) movable relative to each other and closable onto each other. The means for causing the mould halves to move and to close are formed by a rotatable eccentric which can be coupled to one of the mould halves with interposing of at least one connecting rod (11). The invention also relates to a method for driving such a device. Another aspect of the invention relates to an encapsulating device wherein a one mould half (3) is connectable to the means for causing the mould halves to move and close and the second mould half (2) is connectable to a counter-plate (21) which forms part of the device, which counter-plate is displaceable between two end positions. Yet another aspect of the invention relates to an encapsulating device with a counter-plate (21), which counter-plate comprises: a plurality of stacked, substantially plate-like parts (27, 28), between which parts at least one shaft (29, 30) is placed. Finally, a last aspect of the invention is formed by means for exerting pressure on encapsulating material comprising at least two screw spindles (32, 33, 34, 35).