MOULD ASSEMBLY AND METHOD FOR USE THEREOF

摘要

The invention relates to a mould assembly for encapsulating electronic components mounted on so-called lead frames, comprising: support elements which can be coupled to the sides of the two mould halves remote from the sides closing onto each other. The invention also comprises a method for placing at least a part of such a mould assembly in a pressing device. Another aspect of the invention relates to a mould assembly comprising a base in which can be placed a carriage having at least one mould cavity. Another aspect of the invention relates to a mould assembly wherein a plunger can be connected releasably to a plunger carrier.