Semiconductor mounting chip device e.g. ball grid array

摘要

The device includes terminal electrodes (2) formed on one of the two main surfaces of a semiconductor chip (1) and are associated with connecting knobs (5). Also provided is a conductor plate (3) having an upper surface made up with chip binding structures (4) and with electrode regions (20) on the lower surface. Each region includes a connection (7) to the substrate and a ball-shaped terminal (8). Further, the binding structures are connected to terminal electrodes. The connections are formed directly on the lower surface of the conductor plate and the terminals directly on the connections. A resin (6) is hardened and covers the terminal electrodes forming an area region (A1) which is smaller than area (A2), covering the chip binding structures. The process involves a transfer press.