发明名称 METHOD AND APPARATUS FOR LAMINATING BOARDS
摘要 A method for laminating boards includes placing boards (10) with a narrow gap (H) therebetween, inserting an adhesive injection nozzle (32) into the gap, discharging adhesive (40) from the nozzle into the gap so that the discharged adhesive makes into contact with the two boards, continuing discharging the adhesive while the boards are being rotated in a planar direction thereof so that the adhesive is placed in a loop into the gap, retreating the nozzle from the gap, and narrowing the gap between the boards so that the adhesive is spread throughout the gap.
申请公布号 WO9735720(A1) 申请公布日期 1997.10.02
申请号 WO1997JP01042 申请日期 1997.03.27
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD.;KANASHIMA, KEINOSUKE;HIGAKI, NORIHIDE;FUJIOKA, TOSHIYUKI;NOJIRI, SUSUMU;FUKUNO, HIROYUKI;HIROTA, OSAMU 发明人 KANASHIMA, KEINOSUKE;HIGAKI, NORIHIDE;FUJIOKA, TOSHIYUKI;NOJIRI, SUSUMU;FUKUNO, HIROYUKI;HIROTA, OSAMU
分类号 G11B7/26;B29C65/52;B29D17/00;B29L9/00;B29L17/00;B32B37/00 主分类号 G11B7/26
代理机构 代理人
主权项
地址