Halbleiterlaservorrichtung

摘要

A lead frame 32 has projecting piece portions (36, 37) projecting in a right-and-left direction, like arms, from the sides of its broad end portion (32a). The projecting piece portions (36, 37) comprise mold regions (36a, 37a) molded with a flat type sealing resin member (35), and exposed piece portions (36b, 37b) exposed to the outside from the sealing resin member (35). One of the exposed piece portions(36b), has an arcuate piece portion (36c) inscribed in a hypothetical circle drawn with radius R about the point of light emission, C, on an LD chip (1) . The other exposed piece portion (37b) has an arcuate piece portion (37c) inscribed in the hypothetical circle drawn with radius R about the point of light emission, C, on the LD chip (1). A semiconductor laser device having these arcuate piece portions can be fitted into a stepped accommodating hole of an instrument and set in place there, as can a can type semiconductor laser device. The point of light emission, C, on the LD chip (1) is also fixed. Thus, neither a shift in the point of light emission, C, nor the peeling of resin arises. Moreover, an annular mounting aid (48) inscribed in the hypothetical circle drawn with radius R can be attached, instead of the arcuate piece portions (36c, 37c), to the exposed piece portions (36b, 37b), whereby the same effects can be obtained.