PRODUCTION OF ELECTRICAL CIRCUIT BOARDS

摘要

In a process for producing a circuit board, a conductive layer (27) and a resist layer (25) are formed over a substrate (21). The resist layer (25) is patterned to define a wiring pattern. Electrolysis is used to define the wiring pattern (37), using the conductive layer (27) as the plating electrode. The conductive layer (27) is formed as a coating of a conductive ink, over the patterned resist (25).