| 摘要 |
PURPOSE: To protect an electronic component from a pressure given by a heat- dissipating member by a method wherein, when a heat-dissipating plate is attached to the top surface of the electronic component and the lower end of the lower leg of the heat-dissipating plate is placed on a board, a gap is formed between the top surface of the board and the bottom surface of the heat-dissipating plate. CONSTITUTION: Cylindrical lower legs 11 are installed at the rear surface of a heat-dissipating plate 12, and cylindrical upper legs 13 are installed at the surface. Then, the lower legs 11 are inserted into holes in a tape carrier 20, and their lower ends are fixed to a board 42 by solder 111. At this time, an LSI chip 40 is bonded to the rear surface of the heat-dissipating plate 12 by an adhesive 44. On the other hand, the upper legs 13 are inserted into holes 431 in a heat sink 43 which is installed at the surface of the heat-dissipating plate 12 so as to be tightened and fixed by knuts 47. In this manner, a gap is formed between the surface of the board 42 and the rear surface of the heat- dissipating plate 12. Thereby, it is possible to protect the LSI chip 40 from a pressure given by the heat sink 43. |
