| 摘要 |
PROBLEM TO BE SOLVED: To obtain a liq. resin sealant excellent in adhesive properties, resistances to moisture and heat, electrical characteristics, and flowability by compounding an epoxy resin having a naphthalene backbone with a curative and a silica powder. SOLUTION: This sealant is obtd. by dissolving an epoxy resin having a naphthalene backbone and a curative in a solvent and compounding the resultant soln. with 40-80wt.% silica powder having an average particle size of 30μm or lower and if necessary additives such as an antifoaming agent, a coupling agent, a cure accelerator, a stress-reducing agent, and a colorant. The sealant is charged into a syringe, delivered onto a mounted semiconductor chip using a dispenser or by screen printing, and thermally cured, thus giving a sealed semiconductor device.
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