| 摘要 |
<p>PURPOSE:To surely judge whether defect marks exist in chips having various kinds of size and pattern, by detecting and deciding whether a defect mark exists by use of a mark detecting part, which mark is in position data at the center part of a chip calculated from data for detection. CONSTITUTION:A full cut wafer is mounted on a table 3; by moving the table 3, the center of a chip whose defect mark is to be detected is set below a camera 5; by illuminating the chip from bellow, an image is picked up. The outward form of the chip is recognized from the image; the center position is calculated from the outward form; by illuminating from above, the image is picked up; whether the defect mark at the center position of the chip to be judged exists is discriminated by a mark detecting part 62. Thereby whether the defect mark exists can be surely judged in the case of chips to be judged for which the descrimination of the defect mark is difficult.</p> |
