| 摘要 |
PURPOSE:To provide a method for wire bonding, in which a bonding wedge is prevented from attacking previous bonds. CONSTITUTION:The wire bonding between the first line of pads 3 on a semiconductor chip 2 and a bonding land 9 of a ceramic case is carried out with respect to registration patterns 12 on the chip. Next, the wire bonding between the bonding lands 9 and 6 of the ceramic case with respect to the bonding coordinates based on bonding pads 5 that are l/2 pitch off the first line of pads and are not actually bonded. |
