发明名称 POLISHING DEVICE
摘要 PROBLEM TO BE SOLVED: To simplify a mechanism, reduce scattering of a washing fluid, effectively clean a top ring lower surface, so that a conveying hand and a polished workpiece can be cleaned. SOLUTION: This washing mechanism 30, in a polishing device polishing a polished workpiece, advances to the downward of a top ring 20 in a condition waiting in a specified position, and injectes a washing fluid, to a lower surface of the top ring 20 for cleaning. Other wise, washing mechanism 30 is provided in a specified position of a table dome covering an upper part specified range of a turn table 10 to prevent a fluid from scattering to the outside, and is constituted so as to wash a lower surface of the top ring in standby in a specified position.
申请公布号 JPH09254017(A) 申请公布日期 1997.09.30
申请号 JP19960090567 申请日期 1996.03.19
申请人 EBARA CORP 发明人 TOGAWA TETSUJI;NISHI TOYOMI
分类号 B24B53/017 主分类号 B24B53/017
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