| 摘要 |
PROBLEM TO BE SOLVED: To provide a method for manufacturing an electronic product which can prevent a particle-like curing agent from being separated from a protective resin and uniformly cure the entire resin with excellent adhesive state between a spacer and a cover. SOLUTION: A recess 100 is formed of a spacer 10 and a circuit board 11, and an electronic component 16 is mounted in the recess 100. Then, the protective resin 13 is filled in the recess 100, and a cover 12 is laminated on the upper surfaces of the spacer 10 and the recess 100 via an adhesive. The adhering between the spacer 10 and the cover 12 and curing of the resin 13 are simultaneously conducted. The resin 13 contains the particle-like curing agent 131, which contains 50wt.% or more of the agent having particle size of 10μm or less in the agent 131. |
