| 摘要 |
PURPOSE:To facilitate peeling of electrodeposited image from a supporting base material and to prevent bleeding out of adhesive after sticking to an adherend by removing the adhesive near the electrodeposited image together with the wire-shaped electrodeposition after forming an adhesive layer for fixing on the electrodeposited image and wire-shaped electrodeposition enclosing the image at the time of providing the electrodeposited image with the adhesive layer. CONSTITUTION:The electrodeposited image 2 and the wire-shaped electrodeposition enclosing the image are formed on the front surface of a conductive base material and thereafter, the electrodeposited images 2 and the wire-shaped electrodeposition are peeled from the conductive base material and are transferred onto a pressure sensitive adhesive layer 14 formed on the supporting base material 13. The adhesive layer 15 for fixing is then formed over the entire surface on the holding side of the electrodeposited image 2 and the wire-shaped electrodeposition and thereafter, the wire-shaped electrodeposition is removed. The electrodeposited image 2 is then stuck to the surface of the adherend 17 via the adhesive layer 15 for fixing while the electrodeposited image 2 is peeled from the supporting base material 13. The conductive base material to be used consists of a metallic sheet and a conductive thin film formed thereon. The pressure sensitive adhesive is preferably a UV-curing type. |
