| 摘要 |
PROBLEM TO BE SOLVED: To make capable efficient dressing without enlarging an occupied area of a dresser, in a polishing device polishing a semiconductor wafer or the like. SOLUTION: In a dresser 30 for dressing a polishing cloth 12a secured onto a surface plate 12, a dressing tool of different kind is provided so as to arrange a brush 30a, for instance, around a grinding tool 30b. In the case of polishing, the surface plate 12 is rotated, on the other hand, a wafer 16 is sucked, held by wafer holding part 18, while rotated and brought into press contact with the polishing cloth 12a. In parallel to polishing thus performed, the dressing tool of the dresser 30 is brought into press contact with the polishing cloth 12a and rotated, dressing is performed. The brush 30a and the grinding tool 30b may be constituted to be mutually independently rotated and driven. The dresser 30, may be swiveled, while rotating. |
