| 摘要 |
<p>A multilayer printed wiring board substrate (1) has conductive traces (2) thereon and a plurality of vias (3) therethrough. The substrate (1) has a topside soldermask (9) and a bottomside soldermask (10). The bottomside soldermask (10) has moisture relief areas (15) disposed over the vias (3). A process for improving yield of a chip on board device comprises the steps of applying a coating of soldermask to a surface of a printed wiring board substrate and creating an opening in the soldermask disposed over one or more vias.</p> |
