Anordnung mit einem Stapel elektronischer Submontagen
摘要
Disclosed is an article comprising a stacked array of electronic subassemblies, each subassembly including one or more integrated circuits (50) and a thermally conductive base member (15) that is perforated with holes (70). Motivating means (80) are provided for causing a coolant fluid to pass through the holes in a direction substantially parallel to the stacking axis.
申请公布号
DE69030288(T2)
申请公布日期
1997.09.25
申请号
DE1990630288T
申请日期
1990.07.18
申请人
AT & T CORP., NEW YORK, N.Y., US
发明人
LEE, YUNG-CHENG, SOMERSET, NEW JERSEY 08873, US;SEGELKEN, JOHN MAURICE, MORRISTOWN, NEW JERSEY 07960, US