| 摘要 |
<p>PURPOSE:To automate rearrangement for a back-to-back pattern perfectly by picking up wafers out of a container for bodies under treatment at a double pitch, and rotating the said wafer train and the remaining wafer train so that the treating surfaces of the wafers relatively face to each other. CONSTITUTION:One carrier 20 is set at the upper part of a 180 deg.-rotary pusher 5. A pushing-up plate 62 is moved upward by the driving of a wafer pushing-up and rotating device 60. Chucks 48 and 48 are driven and closed. The half of the total wafers (w) are supported one after another and moved upward. Then, a chucking device 40 is moved along rails 50 and 50, and the wafers (w) are set at a positions which is separated from the directly upper part of the carrier 20. Thereafter, the remaining half of the wafers (w) on the pushing-up plate 62 are moved upward by the second lifting movement of the pushing-up plate 62. The pushing-up plate 62 is rotated. After the rotation of the wafers (w), the pushing-up plate 62 is lowered and moved, and the half of the wafers (w) are inserted into groove 20as of the carrier 20 and supported. Then, the half of the wafers (w) which are supported with the chucks are moved to the corresponding positions of the carrier 20 and lowered.</p> |
