| 摘要 |
<p>A perimeter independent precision locating member (22) for a semiconductor chip (10) for ensuring that contact sites (20) upon the chip will be reliably positioned relative to connection members (18), such as contacts or leads, so that the chip can be electrically engageable. The locating member (22) is disposed upon the surface of the semiconductor chip (10) at a specific position relative the contact sites within the perimeter (24) of the chip and being closely matable with a complementary portion of a housing (12) that contains the connection members (18). The method of making the perimeter independent precision locating member (22) for a semiconductor chip (10) involves coating the chip with a layer of photocurable material, masking the material in relation to the contact sites so that the portion of the material that will become the locating member (22) is exposed, illuminating the exposed portion of the photocurable material, and stripping from the chip the uncured portion to define the locating member (22). <IMAGE> <IMAGE></p> |
