发明名称 SHINSHUKUGATAGENATSUKEISEIWAKU
摘要 <p>PURPOSE:To avoid the interference of a vacuum molding frame with a laminated plate and to smoothly proceed the molding work of the laminated plate by providing a tube for forming a space isolated from the exterior in a frame in contact with a carrier plate to be conveyed to the upper face of a hot board of the lower side expanded when the air is introduced into the frame provided at the lower side of the hot board of the upper side. CONSTITUTION:A reduce pressure molding frame 12 is formed in a state that a tube 14 is collapsed in a flat state by the evacuation of the air in a bag of the tube 14, and a size between the upper face of a hot board 11b and the tube 14 is expanded in the largest size. A carrier plate 18 on which a copper-planted laminated layer P is placed is inserted between hot boards 11a and 11b. The hot board 11b is moved upward upon rising of a ram, the copper- plated laminated plate P is pressed to the lower face of the hot board 11b, and the copper- plated laminated plate P is set. A valve which interrupted the flow of compressed air is opened to introduce the air into the bag of the tube 14 through the connection hole 16 of the hot board 11b. The tube 14 is expanded, and its end is brought into close contact with the carrier plate 18. Vapor or heat medium oil is introduced to the hot board 1, and the copper-plated laminated plate P disposed between the hot boards 11a and 11b is molded to a predetermined thickness.</p>
申请公布号 JP2657540(B2) 申请公布日期 1997.09.24
申请号 JP19880317279 申请日期 1988.12.15
申请人 TOSHIBA KEMIKARU KK 发明人 SEKINE HIDEO
分类号 B32B15/08;B32B37/10;B32B43/00;(IPC1-7):B32B31/20 主分类号 B32B15/08
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