| 摘要 |
PURPOSE:To obtain a wafer having an arbitrary warped shape. CONSTITUTION:An ingot position correcting mechanism 25 and air pads 28A and 28B are provided in the slicing machine concerned. The displacement to the cutting direction (X-X direction) of a blade 14 is controlled with the ingot position correcting mechanism and, at the same time, the displacement to the direction (Y-Y direction), which is normal to the cutting direction of the blade 14, is controlled with the air pads 28A and 28B. |
