| 摘要 |
A semiconductor device (10, 20) includes a stage (14a) having top and bottom surfaces, a semiconductor element (13) which is mounted on the top surface of the stage, a package part (11) which is made of a first resin and encapsulates the semiconductor element so that a surface (11a) of the package part (11) and the bottom surface (14a-1) of the stage (14a) lie on substantially the same plane, and a radiation part (12, 21) which is made of a second resin and is provided directly on the bottom surface (14a-1) of the stage (14a) and the surface (11a) of the package part (11). The second resin includes a filler material selected from a group consisting of metal powders and insulator powders so that a thermal conduction of the second resin is greater than that of the first resin. <IMAGE> |
