Polishing apparatus

摘要

A polishing apparatus (70) is used for polishing a workpiece such as a semiconductor wafer (2) to a flat mirror finish by a combination of chemical polishing and mechanical polishing. The polishing apparatus (70) includes a turntable (73) with a polishing cloth (74) mounted on an upper surface thereof, a top ring (75) for supporting the workpiece (2) to be polished and pressing the workpiece (2) against the polishing cloth (74), and a dressing tool (79) for dressing the polishing cloth (74) on the turntable (73). The polishing apparatus (70) further includes a cover (10) which covers an upper surface of the turntable (73) for preventing liquid on the turntable (73) from being scattered, and inserting holes (17,21) formed in an upper wall (11) of the cover (10) for inserting the top ring (75) and the dressing tool (79) therethrough.