发明名称 Method for fabricating self-aligned semiconductor component
摘要 A self-aligned semiconductor component (10) includes a layer (14) having two openings (36, 38) and overlying a doped region (13) in a substrate (11). One (36) of the two openings (36, 38) is used to self-align a different doped region (22) and a portion (27) of an electrode (27, 31). The electrode (27, 31) has another portion (31) overlying the self-aligned portion (27) to increase the current carrying capacity of the electrode (27, 31). A different electrode is formed in the other one (38) of the two openings (36, 38) and has a smaller current carrying capacity than the other electrode (27, 31).
申请公布号 US5670417(A) 申请公布日期 1997.09.23
申请号 US19960622535 申请日期 1996.03.25
申请人 MOTOROLA, INC. 发明人 LAMBSON, CHARLES T.;SANDERS, PAUL W.
分类号 H01L21/331;(IPC1-7):H01L21/225 主分类号 H01L21/331
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