发明名称 Lead-frame forming material
摘要 Disclosed are a positive type lead-frame forming material which contains a light-sensitive material comprising an o-quinonediazide compound and a novolak resin, and a positive type lead-frame forming material which contains a positive resist composition comprising (1) a water-insoluble but alkaline water-soluble resin, (2) a compound capable of generating an acid by irradiation with active rays or radiant rays, and (3) a compound containing a group decomposable by acid which can increase its solubility in an alkaline developer through the action of the acid.
申请公布号 US5670293(A) 申请公布日期 1997.09.23
申请号 US19950402000 申请日期 1995.03.10
申请人 FUJI PHOTO FILM CO., LTD. 发明人 NARUSE, YASUHITO;KAMITANI, KIYOSHI;UESUGI, AKIO;KAKEI, TSUTOMU;MOROHOSHI, GOUICHI
分类号 B41N1/24;G03F7/022;H01L21/48;H01L21/60;(IPC1-7):G03F7/09;G03F7/095 主分类号 B41N1/24
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