| 发明名称 |
Method of making high input/output density MLC flat pack |
| 摘要 |
A high density I/O flat pack electronic component is provided comprising a multilayer ceramic substrate having internal electrical conductors for electrically connecting I/O pads on the periphery of the component to a chip on the electronic component.
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| 申请公布号 |
US5669136(A) |
申请公布日期 |
1997.09.23 |
| 申请号 |
US19950541397 |
申请日期 |
1995.10.10 |
| 申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
MAGEE, ROBERT ARTHUR |
| 分类号 |
H01L23/12;H01L23/498;(IPC1-7):H05K3/36 |
主分类号 |
H01L23/12 |
| 代理机构 |
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代理人 |
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| 主权项 |
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| 地址 |
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