发明名称 |
Electric circuit card having a donut shaped land |
摘要 |
A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.
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申请公布号 |
US5670750(A) |
申请公布日期 |
1997.09.23 |
申请号 |
US19950429612 |
申请日期 |
1995.04.27 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
LAUFFER, JOHN MATTHEW;RUSSELL, DAVID JOHN;HANSEN, JAMES JENS |
分类号 |
H05K1/05;H05K1/02;H05K1/11;H05K3/00;H05K3/34;H05K3/40;H05K3/44;H05K3/46;(IPC1-7):H05K1/02 |
主分类号 |
H05K1/05 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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