发明名称 Electric circuit card having a donut shaped land
摘要 A metal carrier has a dielectric material with a thickness of less than 0.004 inch and electrical voltage insulation characteristics of at least 2500 volts formed on a surface. A donut configured land defines at least one via or opening for removing dielectric material selectively. Reflow solder is used to form electrical interconnections, and the vias provide thermal dissipation sufficient to conform to safety requirements.
申请公布号 US5670750(A) 申请公布日期 1997.09.23
申请号 US19950429612 申请日期 1995.04.27
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 LAUFFER, JOHN MATTHEW;RUSSELL, DAVID JOHN;HANSEN, JAMES JENS
分类号 H05K1/05;H05K1/02;H05K1/11;H05K3/00;H05K3/34;H05K3/40;H05K3/44;H05K3/46;(IPC1-7):H05K1/02 主分类号 H05K1/05
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