CUTTING METHOD AND DEVICE OF SEMICONDUCTOR INGOT FOR EPITAXIAL WAFER SEMICONDUCTOR,申请号JP19960054338-传众专利搜索

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发明名称	CUTTING METHOD AND DEVICE OF SEMICONDUCTOR INGOT FOR EPITAXIAL WAFER SEMICONDUCTOR
摘要
申请公布号	JPH09248719(A)	申请公布日期	1997.09.22
申请号	JP19960054338	申请日期	1996.03.12
申请人	SHIN ETSU HANDOTAI CO LTD;HODEN SEIMITSU KAKO KENKYUSHO LTD	发明人	MISAKA HITOSHI;KURODA YASUYOSHI;HASEGAWA FUMIHIKO;FUTAMURA SHOJI
分类号	B23H7/02;(IPC1-7):B23H7/02	主分类号	B23H7/02
代理机构		代理人
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地址

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