| 摘要 |
PROBLEM TO BE SOLVED: To improve the flatness and roughness of whole surface and restrain the largeness of device in the case of largeness of dia. by moving a retaining member by a moving mechanism, rotating the retaining member by a rotation mechanism, and polishing the surface of device wafer by means of polishing part composed of polishing tape continuously transferred. SOLUTION: A device wafer W is manually or automatically fed to a retaining member 2 and fixed by a suctionwise fixing mechanism and the like, and the member 2 is rotated in an atmosphere of dry condition or wet condition to supply polishing liquid according to the conditions of machining. A polishing tape T is transferred to one direction by a tape transfer mechanism 15 and under the condition the member 2 is lowered by a upward/downward moving mechanism 7, and brings the device wafer W into pressure contact with a polishing part 33 positioned to face the wafer W, then polishing work for flatness is carried out. Accordingly, the surface of wafer W can be polished by the complex actions of the rotation action and one way transfer action of the polishing tape T. |
