| 摘要 |
PROBLEM TO BE SOLVED: To improve the flatness and the surface roughness of the whole front surface of a device wafer by polishing the front surface of the device wafer by the composite action of the rotating action of the device wafer, the feeding action of the device wafer, and the one-way transferring action of an abrasive tape, and preferentially polishing only a projecting part regardless of the size of a device pattern and the state of density. SOLUTION: A device is provided with a placing table 9 on which a device wafer W can be placed, a tape transferring mechanism 11 for continuously transferring an abrasive tape T at the position facing the placing table and provided with an abrasive part 33 formed by folding and guiding the abrasive tape, a moving mechanism 2 for moving the placing table or the tape transferring mechanism, and a rotational mechanism 3 for rotating the placing table or the tape transferring mechanism. |
