发明名称 FLEXIBLE WIRING SUBSTRATE AND MANUFACTURE OF THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a flexible wiring substrate which controls generation of curl. SOLUTION: In a flexible wiring substrate wherein two or more layers of plastic films manufactured by extending in two directions of vertical and lateral directions are stacked, elliptic bodies having respective line expansion coefficients are formed on the coordinates at the portions corresponding with each other to the two plastic film surfaces located at both outer most layers. There is provided the relationship that the maximum value of the difference of the line expansion coefficients of the plastic films obtained by stacking the elliptic bodies so that the center matches the coordinate axes is 1.4×10<-5> (1/ deg.C) or less.
申请公布号 JPH09252169(A) 申请公布日期 1997.09.22
申请号 JP19960222431 申请日期 1996.08.23
申请人 NITTO DENKO CORP 发明人 MIKI YOSUKE;MIYAAKE NORIHARU;SUGIMOTO TOSHIHIKO
分类号 H05K1/03;H05K1/02;(IPC1-7):H05K1/03 主分类号 H05K1/03
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