| 摘要 |
PROBLEM TO BE SOLVED: To obtain a bonding material, excellent in thermal conductivity and adhesion, initiating no crack and useful for production, etc., of a semiconductor device having high reliability without short-circuiting between the wirings, etc., by including a thermoplastic resin having reactive functional groups, a tackifier, a cross-linking agent and a specific filler therein. SOLUTION: This adhesive substance comprises (A) a main component composed of a thermoplastic resin having reactive functional groups, (B) a tackifier, (C) a cross-linking agent and (D) a filler having the smooth surface (e.g. a spherical or ellipsoidal material which is a fused or a crystal silica previously coupling-treated by a glycidyl-based silane coupling agent, having 3-30μm number-average particle diameter D50, containing no particle having <=1μm or having >=1μm particle diameter D5 at 5% point). A semiconductor device is obtained by using the bonding material for adhering between a base plate and a wiring layer in the device. |
