| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a new pre-alignment method which carries out alignment in a non-contact manner and is interchangeable with a conventional pre- alignment method where pins are used. SOLUTION: A wafer W1 is placed on the center-up of a wafer stage, the image of the periphery of the wafer 1 is picked up in observation visual fields 50a, 51a, and 52a and measured, and the position and posture of the wafer W1 placed on the center-up are obtained from the measurement result. Thereafter, the center-up is driven to rotate the wafer W1 to make a pre-alignment of it so as to make the position and posture of the wafer W1 equal to a pre- alignment result obtained by a conventional pre-alignment method where pre- alignment is carried out by making pins P1 , P2 , and P3 bear against the wafer W1 . Thereafter, the center-up is made to descend to place the wafer W1 in a substrate holder, and the wafer W1 is fixed by vacuum suction.</p> |
