| 摘要 |
<p>PROBLEM TO BE SOLVED: To effectively of the alignment to reduce the mean treating time and throughput by doing the final alignment immediately after conveying to a baking position and, only when impossible, doing the prealignment. SOLUTION: After conveying wafers to an alignment position (S202), the possibility of the final alignment at a scale factor of 50 is judged (S203), if possible, the final alignment is executed (S204). If impossible, a TV-prealignemt is done with a scale factor of 10 (S205). Then the final alignemt is executed to en the alignment. Thus, unwanted prealignment step is omitted according to the condition of the entrance of wafers to be exposed, etc., to effectively execute the alignment.</p> |
