APPARATUS AND METHOD FOR FLATNESS CORRECTION

摘要

PROBLEM TO BE SOLVED: To provide a flatness correcting apparatus capable of easily correcting the flatness of a plate-like sample such as wafers fixed to a sample setting face of a sample table in an exposure process of a semiconductor device. SOLUTION: This apparatus comprises a sample table 6 having a soft flexible layer on a sample mounting face 63 to mount a plate-like sample 1 and suction holes 64 and vacuum apparatus capable of controlling separately the suction forces of the suction holes 64 of the face 63 divided into at least two regions. This vacuum apparatus has switching valves 7 connecting respectively to the holes 64 and independently controllable vacuum pumps to which the valves 7 are respectively connected.