| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminated the vertical movements of a support plate at the time of molding a semiconductor chip fixed to the plate, by casting resin in the cavity of a transfer mold to form a sealer in the state that the plate of a lead frame is supported in a predetermined height by a magnetic force at the time of transfer molding. SOLUTION: After an assembled lead frame 15 is mold clamped in the mold 30 of a transfer molding machine, electromagnets 41, 41 contained in lower and upper molds 31, 32 are magnetized by a controller 45 to predetermined magnetic force. As a result, the upper and lower surfaces of a permanent magnet 11 fixed to a support plate 4 are repelled to the upper surface of the electromagnet 41 of the mold 31 and the lower surface of the electromagnet 42 of the mold 32. Accordingly, the plate 4 is extended parallel to the bottom 46 and the ceiling 47 of the cavity, and supported by the magnetic forces of the electromagnets 41, 42. Melted resin 50 is cast in the cavity 35 from the gate 34 in this state to cover the material to be sealed such as the plate 4, a semiconductor chip 6 and the like with sealant.</p> |
