发明名称 SURFACE ACOUSTIC WAVE ELEMENT, FREQUENCY ADJUSTMENT METHOD THEREFOR AND ELECTRONIC EQUIPMENT
摘要 PROBLEM TO BE SOLVED: To stabilize frequency characteristics by joining the cover of a second member to a substrate by a joining member and pulling out an electrode to the outside while being in contact with the joining member in a surface acoustic wave element for which the electrode is formed on the substrate composed of the piezoelectric body of a first member. SOLUTION: The electrode 5 for generating surface acoustic waves is provided on a piezoelectric body substrate 1 and the electrode 5 is connected to an external circuit by a pad electrode 3. In this case, the substrate 1 is crystal and the cover 2 is joined through the joining member 4 onto the electrode for connecting a part of the electrode 3 or the electrode 5 and the pad electrode 3. The cover 2 uses quartz glass. The joining member 4 is formed so as to vacuum-deposit a glass material whose fusing point is around 450 deg.C to the cover 2 and recess a part facing the electrode 5 including the cover 2 thereafter. Thereafter, the cover 2 is piled up on the substrate 1 so as to make the joining member 2 face each other, the glass is fused under a high temperature and joining is performed. Thus, the cover of a wafer state similarly is joined altogether to the piezoelectric substrate of the wafer state and the frequency is stabilized.
申请公布号 JPH09246906(A) 申请公布日期 1997.09.19
申请号 JP19960055207 申请日期 1996.03.12
申请人 SEIKO EPSON CORP 发明人 IWAMOTO OSAMU
分类号 H03H3/10;H03H9/25 主分类号 H03H3/10
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