| 摘要 |
<p>PROBLEM TO BE SOLVED: To restrain dispersion of desired fusing time, by forming composition of fine conducting particles, glass power having a melting point higher than the temperature for forming a film of the fine conducting particles, and solvent for uniformly dispersing the conducting particles and glass powder. SOLUTION: This composition is formed of fine conducting particles, glass powder having a melting point higher than the temperature for forming a film of the fine conducting particles, and solvent for uniformly dispersing the conducting particles and the glass powder. The composition is constituted of fine conducting particles, glass powder having a melting point higher than the temperature for forming a film of fine conducting particles, resin which is decomposed.burned at a temperature lower than the temperature for forming a film of the fine conducting particles, and solvent for dissolving the resin. The fine conducting particles and the glass powder are uniformly dispersed in the resin. The film formation temperature of the fine conducting particle is 200-400 deg.C, and the melting point of the glass powder is 400-600 deg.C. Thereby fine metal powder in a resistance film quickly diffuses into glass component, and fusing time can be stabilized.</p> |
