OPTICAL ELECTRONIC INTEGRATED PACKAGE

摘要

PROBLEM TO BE SOLVED: To provide an integrated package having light emitting element (LED) display chips on which light emitting elements (LEDs) cooperatively forming complete images are formed. SOLUTION: The LEDs 12 are arranged in a matrix and are connected to the connecting/mounting pads 22 adjacent to the outer edges of the chips 14. A transparent mounting substrate is provided with a central aperture. A driver substrate is provided with the mounting pads and the many pads on the mounting substrate are connected by bump bonding. Many driver boards are connected via the terminals of the driver board to the LEDs 12. The lenses are mounted at the mounting substrate on the side opposite to the LED display chips in such a manner that the lenses come above the arrays 15 of the LEDs 12, by which the complete images are magnified or are used as one element of an optical magnifying system. The easily visible virtual images are thus formed.