| 摘要 |
PROBLEM TO BE SOLVED: To provide the title high density area.grid.array.package capable of packaging multiple pin semiconductor in a simple constitution as well as the manufacturing method of said package at low cost. SOLUTION: This package is manufactured by a method wherein a wiring circuit 4 with lattice point type pad electrode 5 is formed on the first surface of an insulating base substance, also a semiconductor chip 6 is mounted on said surface so as to electrically connect to each wiring circuit 4 as well as resin molded so that a solder ball 9 may be molten to be fixed to an aperture part 8 made from the base substance A on the rear side of the pad 5 to be connected to the back of the pad electrode 5. |
