首页
产品
黄页
商标
征信
会员服务
注册
登录
全部
|
企业名
|
法人/股东/高管
|
品牌/产品
|
地址
|
经营范围
发明名称
PROCESSING METHOD OF SILICON WAFER AND ELECTRONIC DEVICE WHEREIN THE SILICON WAFER IS USED
摘要
申请公布号
JPH09246234(A)
申请公布日期
1997.09.19
申请号
JP19960055208
申请日期
1996.03.12
申请人
SEIKO EPSON CORP
发明人
YOTSUYA SHINICHI
分类号
B41J2/16;G01L1/18;H01L21/306;H01L29/84;(IPC1-7):H01L21/306
主分类号
B41J2/16
代理机构
代理人
主权项
地址
您可能感兴趣的专利
A recording and/or reproducing apparatus for a cartridge accommodating a recording medium and an eject mechanism thereof.
Accretion controlling tuyere.
Wafer with epitaxial layer having a low defect density.
Process for treating or working up composite and plastic materials.
Olefin polymerization catalyst and process for preparing polyolefin.
Plasma generating method and apparatus and plasma processing method and apparatus.
Cement products and a method of manufacture thereof.
Device for transferring solid articles.
Fishhook and method of making the same.
Forced engagement logic.
Photographic light-sensitive material with preserved antistatic properties.
Apparatus and method for protecting a programmable logic device from undesired input overshoot voltages.
Complementary-signal BiCMOS line driver with low skew.
METHOD OF DEMAGNETIZATION PREVENTION AND CONTROL FOR ELECTRIC MOTOR.
Workpiece clamping device and use thereof for electrochemical machining of turbine blades.
High-frequency heating apparatus.
COMBINATIONS OF ACE INHIBITORS AND DIURETICS.
Cross-linkable fluorinated copolymers and lacquers based on these copolymers.