| 摘要 |
PROBLEM TO BE SOLVED: To improve the density of a functional memory by causing a mass memory to include a macroblock constituted by a matrix arrangement of stacked chip blocks, constituting a substrate by a monolithic arrangement, and stacking an interconnection network and a control circuit thereon. SOLUTION: N units of basic blocks are stacked in such a manner that a surface having input/output appears constantly on the same side. M sets of N units of basic blocks are coupled in a direction X perpendicular to a direction Y. A matrix arrangement of M×N units of basic blocks constitutes a macroblock which is machine-worked and abraded on the surface. An interconnection network is prepared on this macroblock 13. Then, to prepare a functional memory, various control chips are mounted on an interconnection network 121 on a mounting region prepared on the last layer of the interconnection network. Thus, a memory of extremely large-scale integration may be provided.
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