| 摘要 |
PROBLEM TO BE SOLVED: To enable prevention of diffusion of tin alloy and copper by electroless plating with nickel to form a nickel plated film having a predetermined thickness on a copper pattern of a printed circuit board, etc., without using expensive palladium, electroplating tin or tin alloy on the nickel plated film and then electroplating it with nickel to form a nickel plated film having a thickness of 2μm or more. SOLUTION: In this method, surface treatment of a copper pattern on a printed circuit board is carried out by electroplating the copper pattern to promote its reaction at the time of starting electroless plating on the copper pattern and thereafter by electroless plating it to form thereon a nickel plated film having a predetermined thickness, and by electroplating the nickel plated film with tin or tin alloy. The apparatus includes an initial electroplating bath 1 for performing its electroplating operation for a short time at the time of electroplating the copper pattern of the printed circuit board with nickel, an electroless plating nickel bath 8, and a tin alloy electroplating bath 10, which are all disposed in a continuos processing positional relationship.
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