发明名称 |
ELECTRODE FOR PROCESSING DEVICE UTILIZING PLASMA, AND MANUFACTURE OF SAME ELECTRODE |
摘要 |
PROBLEM TO BE SOLVED: To provide an electrode for a processing device utilizing plasma, and a manufacturing method of the electrode which is of a long service life and low cost, and in which generation of particles and metal contamination are less SOLUTION: An upper electrode 3 disposed at an upper part of a reaction chamber 2 in a parallel flat plate type plasma etching device 1 is formed of a main component of silicone including an electric resistance lowering element. A specific resistance of the upper electrode 3 is set at 0.1Ω.cm-a value in which the element is included by solution limit quantity. In the upper electrode 3, a number of gas supply small holes 3A of a diameter of 0.5mm are bored by an electric discharge machine, and a heat affected layer generated by processing is eliminated by chemical etching.
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申请公布号 |
JPH09245994(A) |
申请公布日期 |
1997.09.19 |
申请号 |
JP19960051432 |
申请日期 |
1996.03.08 |
申请人 |
NAGANO KEIKI SEISAKUSHO LTD |
发明人 |
WATABE MASATO;TAKAHASHI SATOSHI;NAGASAKA HIROSHI |
分类号 |
H05H1/46;C23F4/00;H01L21/205;H01L21/302;H01L21/3065;(IPC1-7):H05H1/46;H01L21/306 |
主分类号 |
H05H1/46 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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