发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURE THEREOF
摘要 PROBLEM TO BE SOLVED: To realize improvement in reliability by fixing a wire on the periphery of a pellet with an insulating cap, then bonding the wire to the distal end of a lead with an adhesive, and fixing the wire to prevent flow, and to realize improvement in productivity by common use of a lead frame. SOLUTION: First, a pellet 1 with a wire 2 is set on a board 8. Then, the pellet 1 is covered with an insulating cap 5 to fix the wire 2 on the periphery of the pellet 1. Next, the pellet 1 with the wire 2 fixed thereto is stripped off from the board 8, and an adhesive is put on the distal end of a lead 4. Then, the pellet 1 with the wire 2 is bonded on the distal end of the lead 4. Thus, flow of the wire 2 due to influence of a resin may be prevented. Also, since the lead 4 is in a radial form with an island eliminated, common use of a lead frame is enabled in accordance with the size of the pellet 1.
申请公布号 JPH09246456(A) 申请公布日期 1997.09.19
申请号 JP19960046437 申请日期 1996.03.04
申请人 NEC KYUSHU LTD 发明人 SHINTANI TADAYUKI
分类号 H01L21/60;H01L23/50 主分类号 H01L21/60
代理机构 代理人
主权项
地址