| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a chip electronic component which enables formation of a fine external electrode having a prescribed thickness on a lateral surface of an electronic component element assembly. SOLUTION: A heat transfer film 7 is overlaid on a lateral surface 3c of an element assembly 3. This heat transfer film 7 includes a base film 7a, a peel-off layer 7b, and an electrode material layer 7c having a prescribed thickness. The side of the electrode material layer 7c is abutted to the lateral surface 3c, and a heater 8 is applied from the opposite side (the side of the base film 7a). Thus, the peel-off layer 7b is peeled off from the base film 7a, and the electrode material layer 7c is attached to the element assembly 3. The electrode material layer 7c on the lateral surface 3c has the prescribed thickness and also has a prescribed width corresponding to the width of the heater 8. |
