| 摘要 |
PROBLEM TO BE SOLVED: To package an electronic part leaving intact directly on a circuit substrate by a method wherein an electronic part protruded downward from a supporting frame is held with the packaged surface thereof tuning downward to release the held electronic part from a flexible film to be transferred to the next step. SOLUTION: The opposite surface to the packaged surface of a chip part 5 is bonded onto a main surface coated with an adhesive so as to arrange a flexible film 12 with its peripheral part held by a supporting frame 18 with the main surface turning downward. Next, a pin body 14 is depressed to push down the chip part 5 together with the flexible film 12 to be held by a suction pallet 15 for lifting the pin body 14 and the flexible film 12 from the flexible film 12. Finally, the chip part 5 released from the flexible film 12 is packaged on a specific position on a circuit substrate 10 using a bonding tool 17. |
