| 摘要 |
PROBLEM TO BE SOLVED: To reduce manufacturing cost and improve mountability in a semiconductor device and a method for manufacturing the semiconductor device. SOLUTION: A semiconductor device is provided with a semiconductor chip 12 and a plurality of leads 14 and 16, and a plurality of leads 14 and 16 are placed on one of the surfaces of the semiconductor chip 12. The leads 16 among a plurality of leads are fixed to one of the surfaces of the semiconductor chip with adhesive 18 which contains thermosetting or photo-curing component.
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