| 摘要 |
PROBLEM TO BE SOLVED: To obtain a low-priced wafer conveying device of a multichamber wafer treatment system in which a throughput is improved and an excellent surface treatment can be conducted. SOLUTION: A load lock chamber 8 is composed of the first load lock chamber 31 to be connected to a load station and the second load lock chamber 32 to be connected to a transfer chamber. These load lock chambers 31 and 32 can be isolated or communicated with each other by a stage 40 where a sheet of wafer 3 is mounted. The first load lock chamber 31 is formed in small cubic volume, and the second load lock chamber 32 is formed in a high vacuum state. A degas heater 54 is provided on the load lock chamber 8. As the second load lock chamber 32 is a double vacuum chamber, the entering of atmospheric air into a transfer chamber is greatly reduced, and as degassing is performed in the treatment time of the process chamber, a throughput is not decreased and gas contamination is not generated. |
